LIMO offers special beam shaping systems for DPSS lasers: due to LIMO's patent technology an ultra-narrow line (8 µm) with highest homogeneity is generated. This laser line can perfectly be used for annealing - as well as for Laser-Lift-Off processes. In comparison to excimer laser annealing process (ELA) the main advantages are lower maintenance costs and a higher system availability.
• Flat panel display production (FPD)
• Semiconductor devices
• Thin film solar cells production
• A-Si on glass
• TCO (ITO) on glass
• Semiconductor wafer (Si, GaAs)